NVIDIA Ampere Streaming Multiprocessors: The all-new Ampere SM brings 2X the FP32 throughput and improved power efficiency.
2nd Generation RT Cores: Experience 2X the throughput of 1st gen RT Cores, plus concurrent RT and shading for a whole new level of ray-tracing performance.
3rd Generation Tensor Cores: Get up to 2X the throughput with structural sparsity and advanced AI algorithms such as DLSS. These cores deliver a massive boost in game performance and all-new AI capabilities.
IP5X dust resistance offers protection from particle ingress for better durability.
A 2-slot design maximizes compatibility and cooling efficiency for superior performance in small chassis.
A stainless steel bracket is harder and more resistant to corrosion.
Auto-Extreme technology uses automation to enhance reliability.
GPU Tweak III provides intuitive performance tweaking, thermal controls, and system monitoring.
SteelSeries Arctis Nova 3X Wireless delivers powerful, high-fidelity sound with custom-tuned Nova Acoustic drivers for an immersive gaming experience. Featuring multi-platform 2.4GHz wireless and Bluetooth connectivity, it’s perfect for Xbox, PC, PlayStation, Switch, and mobile. The ClearCast Gen 2 noise-cancelling microphone ensures crystal-clear voice chat, while 360° Spatial Audio enhances positional awareness in every game. Designed with the ComfortMAX system, it provides a lightweight, adjustable fit for all-day comfort. With long-lasting battery life and premium build quality, the Arctis Nova 3X Wireless is built for serious gamers who demand performance and versatility.
The Mercury M1 Pro – Gradient Black is a premium gaming mouse that combines advanced technology with a sophisticated design. Crafted from durable magnesium alloy, it features a hollowed-out frame that not only reduces weight but also enhances airflow, keeping your hand cool during intense gaming sessions. The gradient black finish adds a touch of elegance, making it a standout accessory for any gaming setup.
The DeepCool EK720 High Performance Thermal Pad is the perfect interface for fast heat transfer on integrated circuit chips that need performance, compatibility, and ease-of-use.