Intel Core i9-14900KF

• RGB Colors & 120° Ultra-Wide Lighting
• Supports Intel XMP3.0 for One-Click Overclocking
• Power Management ICs (PMIC) Equipped for Stable, Efficient Power Usage
• Strengthened PMIC Cooling Design
• On-die ECC for Stable System
• High-Quality ICs Selected for Stability & Reliability
• Equipped with Smart RGB IC Controller that Supports Various Lighting Effect Software
• Taiwan Utility Patent (number:M640994)
• Innovative circuit structure design lowering power consumption and heat
  (Invention patent number in Taiwan: I842298)
  (Invention patent number in the US: US12111715B2)

The Redragon H260 Hylas wired gaming headphones allow you to hear every detail, just as the developer intended.
Listen to everything clearly, from enemy fire to your opponent’s footsteps, so you can focus on winning. The H260 is designed for long gaming sessions, thanks to its lightweight and comfortable design.
Its soft memory foam ear pads and highly adjustable headband allow you to adjust to different head shapes and sizes. The omnidirectional microphone offers optimized technology to cancel out noise and echo, as well as for your chat while playing.

• PBT keycaps: Heat- and wear-resistant, this computer gaming keyboard features the most durable material used in keycap design
• Tactile mechanical switches: Uncompromising performance is always within reach with this wired gaming keyboard
• Premium color, material and finish: Elevate your gaming setup with this backlit keyboard featuring a sleek, black-brushed aluminum top case and white LED lighting
• 6-Key rollover anti-ghosting performance: Experience reliable key input with this anti-ghosting keyboard versus non-gaming mechanical keyboards
• FN key media controls: Twelve (12) function (FN) keys let you control volume, play and pause, skip track, mute, toggle lighting, Windows lock, etc
• Robust body design with minimal flex: The brushed aluminum-magnesium alloy top case serves as the corded keyboard’s backbone

The DeepCool EK720 High Performance Thermal Pad is the perfect interface for fast heat transfer on integrated circuit chips that need performance, compatibility, and ease-of-use.