Enhanced Power Design: 18+2+1 Duet Rail Power System, Dual 8-pin CPU power connectors, Core Boost, Memory Boost
Premium Thermal Solution: Extended Heatsink with Direct Touched Heat-pipe, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads and Double-sided M.2 Shield Frozr are built for high performance system and non-stop gaming experience
High Quality PCB: 8-layer PCB made by 2oz thickened copper and server grade level material
The DeepCool EK720 High Performance Thermal Pad is the perfect interface for fast heat transfer on integrated circuit chips that need performance, compatibility, and ease-of-use.
Power Management ICs (PMIC) Equipped for Stable, Efficient Power Usage
Strengthened PMIC Cooling Design
On-die ECC for Stable System
High-Quality ICs Selected for Stability & Reliability
Equipped with Smart RGB IC Controller that Supports Various Lighting Effect Software
Taiwan Utility Patent (number:M640994)
Innovative circuit structure design lowering power consumption and heat
(Invention patent number in Taiwan: I842298)
(Invention patent number in the US: US12111715B2)